This I/O module offers a Kintex 7 chip with 325k or 410k logic cells, flexible functionality, reconfigurable at any time with functionality from FPGA code modules, or your own algorithms designed in Simulink with HDL code automatically generated using HDL Coder.
Support for either IO33X front plug-ins providing a variety of digital (TTL, LVDS, CMOS), RS485/RS422, and analog functionality, or two front SFP cages for Xilinx Aurora or 10GbE UDP communication.
Optional IO3XX rear plug-ins allow the digital lines of the IO3XX FPGA I/O modules to be accessible from the front of the enclosure, and convert them to TTL, RS422 or RS485.
Multiple IO333 I/O modules can be connected together via the up to 8 rear multi-gigabit transceivers (MGT), supporting the Xilinx Aurora protocol for lowest latency, high bandwidth communication.
Variants
I/O module |
Logic cells |
Front I/O |
Rear I/O |
IO333-325K |
325k |
Connector for front plug-ins |
64 x 2.5V LVCMOS or 32 LVDS digital lines to connect with rear plug-ins for signal conditioning
8 x MGTs
|
IO333-410K |
410k |
Connector for front plug-ins |
64 x 2.5V LVCMOS or 32 LVDS digital lines to connect with rear plug-ins for signal conditioning
8 x MGTs
|
IO333-325K-SFP |
325k |
2 x SFP connectors |
64 x 2.5V LVCMOS or 32 LVDS digital lines to connect with rear plug-ins for signal conditioning
4 x MGTs
|
IO333-410K-SFP |
410k |
2 x SFP connectors |
64 x 2.5V LVCMOS or 32 LVDS digital lines to connect with rear plug-ins for signal conditioning
4 x MGTs
|