This I/O module offers a Kintex 7 chip with 325k or 410k logic cells. Its I/O functionality can be reconfigured, or you can design custom functionality, based on automatically generated code from your Simulink models using HDL Coder™.
Support for either IO33X front plug-ins providing a variety of digital (TTL, LVDS, CMOS), RS485/RS422, and analog functionality, or two front SFP cages for Xilinx Aurora or 10GbE UDP communication.
Optional IO3XX rear plug-ins allow the digital lines of the IO3XX FPGA I/O modules to be accessible from the front of the enclosure, and convert them to TTL, RS422 or RS485.
Multiple IO333 I/O modules can be connected together via the up to 8 rear multi-gigabit transceivers (MGT), supporting the Xilinx Aurora protocol for lowest latency, high bandwidth communication.
Variants
I/O module |
Logic cells |
Front I/O |
Rear I/O |
IO333-325K |
325k |
Connector for front plug-ins |
64 x 2.5V LVCMOS or 32 LVDS digital lines to connect with rear plug-ins for signal conditioning
8 x MGTs
|
IO333-410K |
410k |
Connector for front plug-ins |
64 x 2.5V LVCMOS or 32 LVDS digital lines to connect with rear plug-ins for signal conditioning
8 x MGTs
|
IO333-325K-SFP |
325k |
2 x SFP connectors |
64 x 2.5V LVCMOS or 32 LVDS digital lines to connect with rear plug-ins for signal conditioning
4 x MGTs
|
IO333-410K-SFP |
410k |
2 x SFP connectors |
64 x 2.5V LVCMOS or 32 LVDS digital lines to connect with rear plug-ins for signal conditioning
4 x MGTs
|